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Issue:
New progress of the research and application of phase change material
Author(s):
GUO Cha-xiu
,
CHEN Jun
Pages:
1
-
3
Year:
2006
Issue:
2
Journal:
JOURNAL OF ANYANG INSTITUTE OF TECHNOLOGY
Keyword:
相变材料
;
材料的封装
;
热性能
;
Abstract:
综述了近年来相变材料的研究和应用状况,包括相变材料的封装和热性能研究进展,以及在多领域的应用,展望了相变材料的发展前景.
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